CNC ultra-precision machining methods and types

CNC hyperfine machining is a new machining technology that is accustomed to the development of modern skills. It summarizes the new role of mechanical skills development and the advanced control and inspection methods in modern electronic skills, measurement skills and computer skills, so that the precision of cnc machining can be further advanced, and the limit accuracy of processing can be expanded to nano and sub-nano precision. Many methods of hyperfine machining include cutting, grinding and so on. Among them, hyperfine cutting skills are the use of fine single crystal natural diamond props to process non-ferrous and non-metallic metals. The classification of superfinishing includes removal processing, combination processing and deformation processing.

CNC hyperfine machining skills are one of the important goals to measure the level of advanced production skills in a country, and are the foundation and key of advanced production skills. At present, in the industrial developed countries, the processing accuracy of the general factory can be safely grasped is 1μm. The target of hyperfine machining skills is fine machining accuracy of 1-0.1 μm and surface roughness value of Ra0.3-0.03 μm;

The ultra-fine machining precision is 0.1-0.01μm and the surface roughness is Ra0.03-0.005μm.

Also known as submicron processing; (1 micron =0.001mm), the precision of nano-machining is higher than 0.03μm,

The surface roughness is less than Ra 0.005μm. Hyperfine machining skills can improve the performance and quality of the product, improve its stability and reliability after the production accuracy; Promote the miniaturization of products; Enhance component interchangeability, improve installation productivity, and facilitate automated installation. Fine and hyperfine machining currently includes three categories:

1)CNC ultra-fine cutting, such as ultra-fine diamond tool cutting, can process a variety of mirrors, it successfully processed high-precision gyroscopes, laser mirrors and some large mirrors processing.

2)CNC ultra-fine grinding, such as processing large-scale integrated circuit substrate processing and high-precision hard disk processing.

3)CNC ultra-fine special processing, such as electron beam, ion beam processing, the United States very large scale integrated circuit width reached 0.1μm.

At present, the main ways to complete the ultra-fine machining are: ultra-fine cutting, such as ultra-fine diamond tool mirror turning, boring and milling; Ultra-fine grinding, grinding and polishing; Ultrafine microfabrication (electron beam, ion beam, laser beam processing and silicon microequipment processing, LIGA skills, etc.).